# Data center memory

Memory is key to keeping data flowing to your investment in processor technology – GPUs, CPUs, XPUs. With scalable options from industry-leading HBM3E, high-capacity RDIMMs (96GB and 128GB), memory expansion modules based on CXL, MRDIMM, SOCAMM, and DDR5, Micron has the industry’s broadest portfolio of data center memory solutions to keep your data-intensive AI workloads running.

## SOCAMM  
Micron’s SOCAMM is the first to market with a data center class modular form factor for LPDDR5X and is designed to be the flagship memory solution for AI data centers.  
[View SOCAMM](https://www.micron.com/products/memory/lpddr-modules/socamm)

## High-bandwidth memory  
Explore Micron’s portfolio of high-bandwidth memory products designed to accelerate next-gen AI platforms and high-performance computing.  
[View HBM](https://www.micron.com/products/memory/hbm)

## DDR5 SDRAM  
Discover the next generation of DDR5 DRAM, ideal for enterprise, client, or data center applications. Improve performance, efficiency and stability today.  
[View DDR5 SDRAM](https://www.micron.com/products/memory/dram-components/ddr5-sdram)

## RDIMM  
RDIMM memory is designed for a variety of applications, including enterprise servers and data centers while delivering high performance and stability.  
[View RDIMM products](https://www.micron.com/products/memory/dram-modules/rdimm)

## MRDIMM  
View part catalogs, download data sheets and find other product-related information related to our very low-profile MRDIMM.  
[View MRDIMM products](https://www.micron.com/products/memory/dram-modules/mrdimm)

## CXL memory  
Memory capacity for the data center using the CXL® standard  
[View CXL memory](https://www.micron.com/products/memory/cxl-memory)

## FAQs
### Which memory option uses the lowest power?
SOCAMM is our most power efficient memory solution for the data center.
### What is the data rate, bandwidth, and capacity of HBM3E?
Micron’s HBM3E 8-high and 12-high modules deliver:
- An industry-leading pin speed of greater than 9.2Gbps and can support backward-compatible data rates of HBM2 first-generation devices,
- Bandwidth of more than 1.2 TB/s per placement.
- HBM3E 8-high provides 24GB capacity per placement and our HBM3E 12-high cube will deliver a jaw-dropping 36GB of capacity per placement.
### What type of memory is used in your SOCAMM module?
Our SOCAMM module leverages Micron’s LPDDR5X technology with a proven track record of capacity, performance, and energy efficiency.
### Do you offer a CXL memory solution?
Yes, our CZ122 memory expansion modules are based on the CXL standards.